Method of and device for transporting semiconductor substrate in semiconductor processing system
US5436848A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1993 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Apr 15, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A robot (12) takes a wafer (3f) out of an indexer (1) and then transports the same to a heat processing part (41). A wafer (3e), which has already introduced in the heat processing part (41) is took out thereof by the robot (5). The wafer (3f) is introduced in the heat processing part (41) after a waiting time (18a) so that an excess heat processing in the heat processing part (41) can be avoided. The wafer (3e) is transported to a processing part (43) and introduced therein by the robot (5). After the robot (5) repeats the similar processings in processing parts (13, 42, 44), it returns to the wafer transferring robot (12) to receive a next wafer. At that time, the robot (5) waits for a predetermined time thereby a cycle time is adjusted. After the waiting, the robot (5) takes out the wafer (3f), which has been introduced in the heat processing part (41), out thereof. Since the cycle time is set in common for different lots, the waiting times (18a, 18b) are set individually for each lot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.