Lead frames with improved adhesion to a polymer
US5449951A · kind A · utility
33Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Jul 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.