Reduced pressure processing system and reduced pressure processing method
US5455082A · kind A · utility
29Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jan 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reduced pressure processing system includes a load lock chamber having an opening communicating with a process atmosphere in which a wafer is processed and/or the outer air atmosphere, a gate valve which is arranged at the opening to close/open the chamber with respect to the process atmosphere and/or the outer air atmosphere, a robot for loading/unloading the wafer into/from the chamber, an evacuation pump for evacuating the chamber, a heater for heating the wall of the chamber, and a controller for controlling the gate valve, the robot, the evacuation pump, and the heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.