Microelectronics unit mounting with multiple lead bonding
US5455390A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Feb 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component for mounting semiconductor chips or other microelectronic units includes a flexible top sheet with an array of terminals on it, and with flexible leads extending downwardly from the terminals. A compliant dielectric support layer surrounds the leads, holding the lead tips in precise locations. The leads are desirably formed from wire such as gold wire, and have eutectic bonding alloy on their tips. The component can be laminated to a chip or other unit under heat and pressure to form a complete subassembly with no need for individual bonding to the contacts of the chip. The subassembly can be tested readily and provides compensation for thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.