John W. Smith
160Patents
51h-index
80Co-inventors
93Inventor score
Filing activity: Jul 25, 1975 → Jan 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5518964A | Microelectronic mounting with multiple lead deformation and bonding | Emerging Cross-Sectional Technologies | 478 | Expired |
| US5659952A | Method of fabricating compliant interface for semiconductor chip | Emerging Cross-Sectional Technologies | 367 | Expired |
| US5455390A | Microelectronics unit mounting with multiple lead bonding | Emerging Cross-Sectional Technologies | 333 | Expired |
| US5802699A | Methods of assembling microelectronic assembly with socket for engaging bump leads | Emerging Cross-Sectional Technologies | 326 | Expired |
| US5980270A | Soldering with resilient contacts | Emerging Cross-Sectional Technologies | 217 | Expired |
| US6239384A | Microelectric lead structures with plural conductors | Electricity | 209 | Expired |
| US5801441A | Microelectronic mounting with multiple lead deformation and bonding | Emerging Cross-Sectional Technologies | 204 | Expired |
| US5688716A | Fan-out semiconductor chip assembly | Electricity | 192 | Expired |
| US6117694A | Flexible lead structures and methods of making same | Electricity | 178 | Expired |
| US6002168A | Microelectronic component with rigid interposer | Emerging Cross-Sectional Technologies | 176 | Expired |
| US5615824A | Soldering with resilient contacts | Emerging Cross-Sectional Technologies | 176 | Expired |
| US5632631A | Microelectronic contacts with asperities and methods of making same | Emerging Cross-Sectional Technologies | 175 | Expired |
| US5989936A | Microelectronic assembly fabrication with terminal formation from a conductive layer | Electricity | 174 | Expired |
| US6365975B1 | Chip with internal signal routing in external element | Electricity | 173 | Expired |
| US6202297A | Socket for engaging bump leads on a microelectronic device and methods therefor | Emerging Cross-Sectional Technologies | 171 | Expired |
| US5812378A | Microelectronic connector for engaging bump leads | Emerging Cross-Sectional Technologies | 154 | Expired |
| US6194291A | Microelectronic assemblies with multiple leads | Emerging Cross-Sectional Technologies | 153 | Expired |
| US5929517A | Compliant integrated circuit package and method of fabricating the same | Emerging Cross-Sectional Technologies | 144 | Expired |
| US5663106A | Method of encapsulating die and chip carrier | Emerging Cross-Sectional Technologies | 136 | Expired |
| US6828668B2 | Flexible lead structures and methods of making same | Electricity | 134 | Expired |
| US6012224A | Method of forming compliant microelectronic mounting device | Emerging Cross-Sectional Technologies | 125 | Expired |
| US6130116A | Method of encapsulating a microelectronic assembly utilizing a barrier | Electricity | 118 | Expired |
| US5776796A | Method of encapsulating a semiconductor package | Electricity | 116 | Expired |
| US5994222A | Method of making chip mountings and assemblies | Electricity | 108 | Expired |
| US5913109A | Fixtures and methods for lead bonding and deformation | Emerging Cross-Sectional Technologies | 107 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.