Plastic molded package with heat sink for integrated circuit devices
US5455462A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 15, 1993 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Nov 15, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package including a heat sink is disclosed. The package incorporates an sealing (or locking) ring located circumferentially around the heat sink to provide a better seal between the encapsulant and heat sink and to reduce the possibility that contaminants from outside the package will reach the interior semiconductor die. A stress relief section is formed in the package leads and a dielectric adhesive material is used to attach the package leads to a heat sink surface. The dielectric adhesive creates a secure bond between leads and heat sink, allows heat transfer from the leads to the heat sink, and prevents shorting of the leads to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.