Robert C. Marrs
14Patents
13h-index
4Co-inventors
71Inventor score
Filing activity: Jun 2, 1992 → Feb 10, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5355283A | Ball grid array with via interconnection | Emerging Cross-Sectional Technologies | 452 | Expired |
| US5701034A | Packaged semiconductor die including heat sink with locking feature | Emerging Cross-Sectional Technologies | 286 | Expired |
| US5583378A | Ball grid array integrated circuit package with thermal conductor | Electricity | 197 | Expired |
| US5478007A | Method for interconnection of integrated circuit chip and substrate | Emerging Cross-Sectional Technologies | 131 | Expired |
| US5485037A | Semiconductor device having a thermal dissipator and electromagnetic shielding | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5795818A | Integrated circuit chip to substrate interconnection and method | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5482898A | Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5328870A | Method for forming plastic molded package with heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5455462A | Plastic molded package with heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5483100A | Integrated circuit package with via interconnections formed in a substrate | Electricity | 34 | Expired |
| US5378869A | Method for forming an integrated circuit package with via interconnection | Electricity | 31 | Expired |
| US6163463A | Integrated circuit chip to substrate interconnection | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5722161A | Method of making a packaged semiconductor die including heat sink with locking feature | Emerging Cross-Sectional Technologies | 24 | Expired |
| US9732780B2 | Cantilever assembly | Performing Operations; Transporting | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.