Conditioner for a polishing pad and method therefor
US5456627A · kind A · utility
166Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Oct 10, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.