Metallization composite having nickle intermediate/interface
US5457345A · kind A · utility
35Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1994 |
| Grant date | Oct 10, 1995 |
| Priority date | — |
| Expiry date | Jan 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.