Adolf E. Wirsing
9Patents
6h-index
31Co-inventors
59Inventor score
Filing activity: Sep 8, 1989 → Jul 19, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5130779A | Solder mass having conductive encapsulating arrangement | Electricity | 132 | Expired |
| US5251806A | Method of forming dual height solder interconnections | Electricity | 106 | Expired |
| US5457345A | Metallization composite having nickle intermediate/interface | Electricity | 35 | Expired |
| US5719070A | Metallization composite having nickel intermediate/interface | Electricity | 29 | Expired |
| US6706621B2 | Wafer integrated rigid support ring | Electricity | 25 | Expired |
| US5104695A | Method and apparatus for vapor deposition of material onto a substrate | Chemistry; Metallurgy | 22 | Expired |
| US7288492B2 | Method for forming interconnects on thin wafers | Electricity | 5 | Expired |
| US7138326B2 | Wafer integrated rigid support ring | Electricity | 1 | Expired |
| US6951775B2 | Method for forming interconnects on thin wafers | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.