Method for processing wafer-shaped substrates
US5460478A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 13, 1995 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Mar 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.