Probe apparatus
US5461327A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 31, 1993 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Aug 31, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus tests the electrical characteristics of chips formed on a semiconductor wafer by bringing probes into contact with pads of each chip. The probes, which include ones for power supply potentials, signals, and ground potential, are mounted vertically penetrating a ring block which is attached to the center of a main PCB of a probe card. A tray containing a number of fuses is mounted over the probe card by means of struts. The fuses in the tray connect wires of the main PCB, to which the supply potential of a DC power source is applied, and their corresponding probes. The fuses and the tray can be collectively removed from the probe card to be replaced with new ones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.