High force compression flip chip bonding system
US5462217A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1994 |
| Grant date | Oct 31, 1995 |
| Priority date | — |
| Expiry date | Sep 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of determining the centroid of the pattern formed by the interconnects on the flip chip device. The flip chip device is directed toward the substrate for contacting the corresponding wiring pattern with the interconnects and then the interconnects are compressed into the corresponding wiring pattern using a bonding force. The bonding force is directed along a neutral axis of deflection that is coincident with the centroid. Applying the bonding force along the neutral axis of deflection at the centroid minimizes lateral shifting of the flip chip device relative to the substrate to precisely bond the interconnects to the corresponding wiring pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.