Michael J. Bertram
7Patents
7h-index
4Co-inventors
48Inventor score
Filing activity: Sep 20, 1989 → Sep 15, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5072874A | Method and apparatus for using desoldering material | Electricity | 37 | Expired |
| US4945954A | Method and apparatus for aligning mating form tools | Emerging Cross-Sectional Technologies | 27 | Expired |
| US4934582A | Method and apparatus for removing solder mounted electronic components | Electricity | 25 | Expired |
| US5210936A | Method and apparatus for the excise and lead form of TAB devices | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5368217A | High force compression flip chip bonding method and system | Electricity | 16 | Expired |
| US5283946A | Method and apparatus for forming metal leads | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5462217A | High force compression flip chip bonding system | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.