Embedded inter-connect frame
US5462624A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 1994 |
| Grant date | Oct 31, 1995 |
| Priority date | — |
| Expiry date | Apr 26, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for connecting an I/O pad of an integrated circuit die to an electrical lead or contact on a lead frame that uses interposers formed directly on the die attach pad of the lead frame. Each interposer is formed by etching one or more grooves, preferably of depth no more than half the die attach pad thickness, in the die attach pad adjacent to the lead frame electrical lead(s). The exposed surfaces of the grooves and the die attach pad are coated with a layer of electrically insulating material, and the grooves are then filled with an electrically conducting material, such as conductive epoxy. An electrically conducting wire is then bonded between an I/O pad of an integrated circuit die and the electrically conducting material in the groove, and between the electrically conducting material and an electrical lead of a lead frame. Self-inductance and mutual inductance of the circuit line segments running from the die attach pad to the lead frame electrical lead(s) are reduced by control of the groove dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.