Method for the manufacture of printed circuit boards
US5474798A · kind A · utility
17Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1994 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Aug 26, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.