Automatically adjustable brush assembly for cleaning semiconductor wafers
US5475889A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1994 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Jul 15, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21B45/06
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An automatically adjustable brush assembly for cleaning semiconductor wafers. The brush assembly includes a first rotary brush, a brush carriage having first and second arms and a second rotary brush, and at least one pressure adjustment assembly positioned to engage at least one of the arms of the brush carriage and configured for automatically adjusting the pressure applied to the wafer surfaces by the first and second rotary brushes. The brush assembly further includes a control system coupled to the pressure adjustment assembly for controlling operation of the pressure adjustment assembly to selectively increase and decrease the pressure applied to the wafer by the first and second rotary brushes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.