Adhesion measuring method
US5477732A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 29, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Sep 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An adhesion measuring apparatus includes a measuring device for measuring a Force-Curve at each of multiple measuring points on a sample surface using a cantilever provided at its distal end with a probe which is made of a material to be formed on the sample surface, and a distribution image forming device for calculating adhesion between a material making up the sample surface and the material to be formed on the sample surface from an output of the measuring device, and forming an image of adhesion distribution on the sample surface. An adhesion measuring method includes the steps of adjusting the spacing between a probe which is provided at the distal end of a cantilever and made of a material to be formed on a sample surface and the sample surface to measure a Force-Curve at each of multiple measuring points on the sample surface, calculating adhesion between a material making up the sample surface and the material to be formed on the sample surface at each of the measuring points from the result of measuring the Force-Curve, and forming an image of adhesion distribution on the sample surface from the adhesion calculated for each of the measuring points. With the present adhesi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.