Method of heating and cooling a wafer during semiconductor processing
US5484011A · kind A · utility
34Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1994 |
| Grant date | Jan 16, 1996 |
| Priority date | — |
| Expiry date | Aug 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.