Howard Grunes
30Patents
21h-index
46Co-inventors
85Inventor score
Filing activity: Apr 13, 1981 → Oct 25, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5656093A | Wafer spacing mask for a substrate support chuck and method of fabricating same | Emerging Cross-Sectional Technologies | 778 | Expired |
| US5186718A | Staged-vacuum wafer processing system and method | Emerging Cross-Sectional Technologies | 700 | Expired |
| US5228501A | Physical vapor deposition clamping mechanism and heater/cooler | Electricity | 313 | Expired |
| US5447409A | Robot assembly | Emerging Cross-Sectional Technologies | 117 | Expired |
| US6640151B1 | Multi-tool control system, method and medium | Electricity | 112 | Expired |
| US5690795A | Screwless shield assembly for vacuum processing chambers | Emerging Cross-Sectional Technologies | 79 | Expired |
| US5763851A | Slotted RF coil shield for plasma deposition system | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6468353B1 | Method and apparatus for improved substrate handling | Emerging Cross-Sectional Technologies | 58 | Expired |
| US6486444B1 | Load-lock with external staging area | Electricity | 53 | Expired |
| US5810931A | High aspect ratio clamp ring | Electricity | 48 | Expired |
| US7048837B2 | End point detection for sputtering and resputtering | Electricity | 47 | Expired |
| US5387067A | Direct load/unload semiconductor wafer cassette apparatus and transfer system | Emerging Cross-Sectional Technologies | 42 | Expired |
| US6824612B2 | Electroless plating system | Electricity | 41 | Expired |
| US5484011A | Method of heating and cooling a wafer during semiconductor processing | Electricity | 34 | Expired |
| US6575737B1 | Method and apparatus for improved substrate handling | Electricity | 33 | Expired |
| US7138014B2 | Electroless deposition apparatus | Chemistry; Metallurgy | 30 | Expired |
| US4393663A | Two-phase thermosyphon heater | Mechanical Engineering; Lighting; Heating | 29 | Expired |
| US6368469B1 | Coils for generating a plasma and for sputtering | Electricity | 28 | Expired |
| US6102164A | Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6254746A | Recessed coil for generating a plasma | Electricity | 25 | Expired |
| US5857368A | Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5879127A | Robot assembly | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5868847A | Clamp ring for shielding a substrate during film layer deposition | Chemistry; Metallurgy | 19 | Expired |
| US5556248A | Semiconductor wafer cassette transfer system | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6783639B2 | Coils for generating a plasma and for sputtering | Electricity | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.