Semiconductor device having a thermal dissipator and electromagnetic shielding
US5485037A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1995 |
| Grant date | Jan 16, 1996 |
| Priority date | — |
| Expiry date | Mar 27, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inexpensive packaged integrated circuit with improved heat dissipative capacity and electrical performance. In one embodiment, the packaged integrated circuit includes a semiconductor die, a plurality of electrically conductive package leads, a thermal induction plate and a plurality of electrically conductive bond wires. A surface of the thermal induction plate may remain exposed outside the package. The thermal induction plate reduces package lead inductance and provides shielding of electromagnetic radiation that can cause electromagnetic interference. Preferably, holes are formed through the thermal induction plate to enhance flow of the package material during formation of a package and provide interlocking of the package to the remainder of the integrated circuit. In another embodiment, the packaged integrated circuit further includes a heat sink having a surface exposed to the exterior of the package. The heat sink may also perform an electrical function such as, for instance, acting as a power or ground plane. One or more generally conductive layers can be added to either of the above embodiments. The generally conductive layer or layers may be used to provide ground pla…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.