Deep ultraviolet microlithography system
US5488229A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1994 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Oct 4, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70575
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high resolution, deep UV photolithography system includes a deep UV radiation source for generating a beam of narrow wavelength deep ultraviolet radiation along a path, mask receiving structure in the path, a first optical system in the path for homogenizing and shaping the deep UV energy in the path; and a second optical system in the path for directing radiation energy onto the surface of a substrate to be processed, the second optical system including large area mirror structure having a numerical aperture of at least 0.3 and a plurality of refractive elements disposed between the mask receiving structure and the substrate for compensating (reducing) image curvature introduced into the system by the large area mirror structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.