Edge seal technology for low dielectric/porous substrate processing
US5489465A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1994 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Jun 3, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sealed composite ceramic structure is formed by first forming a plurality of composite green sheets. Each of the green sheets is a composite structure comprising a central portion of partially densifiable material and an outer portion of fully densifiable material. Next, top and bottom green sheets of fully densifiable material are formed. The greensheets are then stacked to form a laminated structure in the following order: the bottom green sheet, the plurality of composite green sheets, and the top green sheet. The substrate laminate is sintered to form the sealed structure having a porous central portion. The composite structure has particular application to ceramic substrates for mounting semiconductor devices requiring low dielectric constant substrates, but the structure also has applications in fluid processing using porous laminated structures. In both applications, the creation of a porous ceramic body with solid, sealed edges and/or external surfaces hold significant advantages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.