Slotted thermal dissipater for a semiconductor package
US5489805A · kind A · utility
24Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.