Semiconductor device and lead frame therefore
US5497032A · kind A · utility
45Cited by
5References
45Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 16, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Mar 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.