Cooling element for a semiconductor fabrication chamber
US5497727A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1993 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | Sep 7, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16L23/036
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A novel semiconductor fabrication chamber includes a quartz vessel and a metal vessel with a resilient sealing member disposed between the quartz and metal vessels to define a vacuum chamber, along with a cooling assembly mounted on a quartz flange extending around the perimeter of the quartz vessel. A liquid or gaseous cooling medium is passed through the cooling assembly to reduce the operating temperature of a portion of the resilient sealing member in contact with the quartz flange during semiconductor fabrication processing so as to extend the useful life of the sealing member. The cooling assembly is secured to the quartz flange using a plurality of clamping fixtures for easy installation and retrofitting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.