Vacuum processing apparatus having improved throughput
US5512320A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Apr 13, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for depositing sequential thin films on glass substrates by single substrate deposition comprising loading a batch of substrates into a load lock chamber and evacuating the chamber, transferring the substrates to a batch heating chamber for heating the substrates to elevated temperatures; transferring the glass substrates singly to one or more single substrate processing chambers, and sequentially transferring the substrates back to the load lock chamber where they are batch cooled. A vacuum system for carrying out the method includes a load lock/cooling chamber for evacuating a plurality of glass substrates; a heating chamber for heating a plurality of substrates to elevated temperatures; one or more single substrate processing chambers; and a transfer chamber having access to all of said chambers and having automated means therein for transferring the glass substrates into and out of said chambers in a preselected order.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.