Composition and method for selective plating
US5518760A · kind A · utility
14Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1995 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | Mar 22, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.