Microelectronic mounting with multiple lead deformation and bonding
US5518964A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1994 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | Jul 7, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.