Semiconductor device having improved leads comprising palladium plated nickel
US5521432A · kind A · utility
53Cited by
7References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, a die-pad on which the semiconductor chip is mounted, a package encapsulating the die pad and the semiconductor chip, and a plurality of leads electrically connected to the semiconductor chip and projecting from the package, wherein each of the leads has a lead body made of pure nickel (Ni) having a purity equal to or greater than 99% and a first film formed thereon, the first film being made of palladium (Pd).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.