Ceramic probe card and method for reducing leakage current
US5532608A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Apr 6, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.