Method of making area direct transfer multilayer thin film structure
US5534466A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for transferring a thin film wiring layer to a substrate in the construction of multilayer chip modules initially provides a sacrificial release layer formed on a surface of a carrier. Directly on the release layer there is formed in inverted fashion a plurality of multilevel thin film structures having at least one wiring path of metallic material exposed on the surface opposite the carrier. An electronic packaging substrate is provided, and solder or other joining material is applied to one or both of the exposed metallic surface of the multilevel thin film structure or the substrate. The multilevel thin film structure is then joined to the substrate so that the attached carrier is remote from the substrate. The release layer is subsequently contacted with an etchant for the release layer so as to remove the carrier from the multilevel thin film structure to produce a multilayer chip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.