Process for preparing a non-conductive substrate for electroplating
US5536386A · kind A · utility
14Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1995 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Feb 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.