Design of high density structures with laser etch stop
US5536579A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1994 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Jun 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first material dielectric material absorbs wavelengths of light that are not the same as wavelengths of light that are absorbed by the second dielectric material. A first layer of the first or the second organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of the other of the first and second organic polymeric materials overlays the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.