Method for the assembly of an electronic package
US5540378A · kind A · utility
14Cited by
25References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1993 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Sep 27, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.