Carrier for testing an unpackaged semiconductor die
US5541525A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1994 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Nov 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect to the base; and a force distribution mechanism for biasing the die and interconnect together. The interconnect includes a substrate having raised contact members adapted to penetrate bond pads, or tests pads, on the die to form an electrical connection. Conductive traces are formed on the substrate in electrical communication with the raised contact members and connect to external connectors formed on the base. The interconnect is adapted for testing a particular type of die but is interchangeable with other interconnects to permit testing of different types of dice using a universal carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.