Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
US5545429A · kind A · utility
16Cited by
13References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1994 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Jul 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.