Vacuum fixture and method for fabricating electronic assemblies
US5546654A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1994 |
| Grant date | Aug 20, 1996 |
| Priority date | — |
| Expiry date | Aug 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on the insulative film. The insulative film is positioned on a porous sheet supported by a vacuum fixture. The porous sheet and vacuum fixture are adapted so as to be capable of creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet. A vacuum is created within the vacuum chamber for flatly holding the insulative film on the porous sheet. A substrate is applied to the insulative film and the at least one electronic component. In one embodiment the substrate is applied by securing the insulative film in position with a mold form having at least one opening around the electronic component and adding substrate molding material at least partially around the component through the opening. In another embodiment the substrate is applied by providing a substrate having at least one well therein and positioning the insulative film over at least a portion of the substrate and the electronic component into the well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.