PVD sputter system having nonplanar target configuration and methods for operating same
US5556525A · kind A · utility
12Cited by
10References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.