Multi-layer circuit structures, methods of making same and components for use therein
US5558928A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1994 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Jul 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials at locations other than the interconnect locations. Excess materials are captured in reservoirs such as within vias in the circuit panels and apertures in interior elements within the interposers. The flowable materials of the interposers, together with the reservoirs, allow the interposers to compress and take up tolerances in the components. The flowable dielectric material encapsulates conductors on the surfaces of the circuit panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.