Leadframe having exposed, solderable outer lead ends
US5563442A · kind A · utility
9Cited by
25References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1995 |
| Grant date | Oct 8, 1996 |
| Priority date | — |
| Expiry date | May 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.