Probe apparatus having burn-in test function
US5568054A · kind A · utility
77Cited by
6References
22Claims
0Family size
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Key dates
| Filing date | May 19, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | May 19, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2868
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus having a burn-in test function includes an apparatus body, a probe card, having a plurality of probes, for causing the plurality of probes to electrically contact a semiconductor wafer, a tester for measuring the electrical characteristics of the semiconductor wafer, heating and cooling mechanisms for applying a thermal stress to test target chips, as targets of the burn-in test, of the semiconductor wafer, and an electrical mechanism for applying an electrical stress to the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.