Rosin-free, low VOC, no-clean soldering flux and method using the same
US5571340A · kind A · utility
26Cited by
29References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1994 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Sep 9, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.