System for applying process liquid
US5578127A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Dec 19, 1995 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Dec 19, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for coating a photoresist on a semiconductor wafer includes a loading/unloading unit and a process unit. A convey path is arranged in the process unit, and an adhesion process section, a pre-bake section, a cooling section, a resist coating section, and a cover film coating section are arranged along the convey path. The adhesion process section, the pre-bake section, and the cover film coating section are arranged in individual process chambers, while the cooling section and the resist coating section are arranged in a common main process chamber. A convey robot is disposed to be movable along the convey path, and a substrate is conveyed among the process chambers by the convey robot. A convey member is arranged in and dedicated to the main process chamber, and the substrate is conveyed from the cooling section to the-resist coating section by the convey member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.