Components for housing an integrated circuit device
US5578869A · kind A · utility
197Cited by
40References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1994 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Mar 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.