PVD sputter system having nonplanar target configuration and methods for constructing same
US5580428A · kind A · utility
15Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.