Modified reaction chamber and improved gas flushing method in rapid thermal processing apparatus
US5580830A · kind A · utility
7Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Feb 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/935
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A reaction chamber for a Rapid Thermal Processing (RTP) system contains an aperture to allow introduction and removal of the object to be processed. The cross sectional area of the aperture is significantly less than the cross sectional area of the reaction chamber. A method of flushing the reaction chamber, using a short time laminar flow of the flush gas, is used in combination with the aperture to increase the throughput of the RTP system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.