Ball grid array integrated circuit package with thermal conductor
US5583378A · kind A · utility
197Cited by
29References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1994 |
| Grant date | Dec 10, 1996 |
| Priority date | — |
| Expiry date | May 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array package and low cost method for manufacture of the same is disclosed herein. The ball grid array package includes a thermal conductor which is a linearly co-extensive outer layer of an interconnection substrate and forms the outer surface of the ball grid array package. An integrated circuit chip is positioned on the underside of the package in a well region. The well region is either formed directly in the interconnection substrate or is formed by the application of a dam. The well region is then filled with an insulating encapsulant material to a predetermined level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.