Method of forming an electrical interconnect
US5587342A · kind A · utility
63Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1995 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Apr 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Interconnect bumps are formed on a circuit substrate using printing or dispensing techniques with a wet photoresist layer as a mask. A conductive paste is disposed in openings of a wet photoresist layer. The conductive paste is at least partially cured before the wet photoresist layer is removed. Alternatively, the wet photoresist layer may remain if it is a photo-imagable polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.