Semiconductor wafer edge polishing system and method

US5595522A · kind A · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Vikki S. Simpson · Sherman, US
• Tom G. Gullett · Sherman, US
• Jerry B. Medders · Howe, US
• Arthur R. Clark · Sherman, US
• Bobby R. Robbins · Denison, US
• Danny R. Newton · Sherman, US
• Lawrence D. Dyer · Richardson, US
• Douglas W. Bilderback · Denison, US
• Clyde A. King · Sherman, US

Key dates

• Filing date: Jan 4, 1994
• Grant date: Jan 21, 1997
• Expiry date: Jan 4, 2014

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/959
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An edge polishing system (20, 320) and method for edge polishing semiconductor wafers is disclosed. The system (20, 320) includes a loader (22, 326), a polisher (24, 328), an unloader (26, 330), and a controller (28, 335). The method includes the steps of loading wafers (28), and spacers (30) into a loader (22) to form a stack (36), moving the stack (36) into a polisher (24) and causing polisher (24) to polish the stack (36), then moving the stack (36) to an unloader (26), which semiautomatically removes the wafers (28) and spacers (30). The system (20) may include a controller (28) for entering the appropriate commands.